Influence of the microstructure and optical constants on plasmonic properties of copper nanolayers

This dataset contains the effective dielectric functions of thin copper layers (12, 25 and 35 nm) thermally deposited on a silicon substrate with the deposition rate 0.5 and 5 angstrom per second. The optical constants of the prepared Cu thin films were investigated by means of the V-VASE device from J.A. Woollam Co., Inc. (Lincoln, NE, USA). Ellipsometric azimuths (Ψ, Δ), were measured for three angles of incidence light (65°, 70° and 75°) in the spectral range 193-2000 nm (0.6-6.5 eV). The analysis of ellipsometric data was performed using the WVASE32 software.

The copper thin layer were evaporated on Si₁₀₀ wafer using the thermal evaporation where the pressure was below 2·10^-5 mbar. Pieces of Cu (99.99%) wire were placed in a molybdenum spiral evaporator, which is 20 cm below the substrate holder. The deposition rate and thickness were controlled by a quartz crystal microbalance - QCM (6.0 MHz).

This data showed that the thickness of a layer and the deposition rate are crucial parameters which affect on the optical and plasmonic properties of the copper films produced by PVD method.

The results of this research are published in T. Rerek et. al, Influence of the microstructure and optical constants on plasmonic properties of copper nanolayers, Materials 2021, 14, 7292..

The results in this dataset are presented in 3 columns separated by a tab. Column 1 - photon energy, 2 - real part (ε₁) of the effective dielectric function, 3 - imaginary part (ε₂) of the effective dielectric function.